A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in ...

A*STAR's Institute of Microelectronics (IME) and United Test and Assembly Center (UTAC), a leading outsourced assembly and test (OSAT) provider, have announced a collaboration to develop a 2.5D ...

As design and manufacturing issues with true 3D design continue to be worked out, interim 2.5D technologies are moving ahead as engineering teams leverage this packaging-driven approach to manage heat ...

SAN JOSE, Calif.--(BUSINESS WIRE)--BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions used to enable and ...

MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...

Synopsys Fusion Design Platform and Custom Design Platform support 7LPP SoCs and SUB20LPIN silicon interposer Immediate foundry customer deployment through Samsung customized design flow Synopsys, Inc ...

Widespread use of 2.5D is still at least a year out from becoming a viable option but specific technical requirements are being identified along the way. The semiconductor industry is still in the ...

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors, connected across ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...

(MENAFN- GetNews) Trends, opportunities, and forecast in 3D TSV and 2.5D market to 2025 by packaging type (3D stacked memory, 2.5D interposer, CIS with TSV, 3D SoC, and Others), end use industry ...

Fig 1. The Xilinx Virtex-7 2000T, at 6.8 billion transistors, is the largest FPGA around (a). It’s implemented using 2.5D Stacked Silicon Interconnect technology (b). Fig 2. Xilinx’s Stacked Silicon ...