At Pharampack 2026, ACG Packing is unveiling the SuperPodâ„¢, its newest innovation in cold-form blister technology. According ...
ACG Packaging Materials has revealed SuperPod, its cold-form blister technology believed to downsize blister cavities by up to 39% and use less material per pack.
Tensentric now offers off-the-shelf liquid reagent blisters with fill volumes ranging from 100 µL to 1.2 mL. Using advanced materials science, the company optimizes forming and lidding materials to ...
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