Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report
Nvidia has asked SK hynix to move up its delivery timeline for next-generation HBM4 memory chips by six months, according to SK Group Chairman Chey Tae-won, reports Reuters.
Nvidia's Jensen Huang requests early shipment of HBM4 from SK Hynix
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM) sector. Specifically,
Nvidia Pushes SK Hynix to Accelerate HBM4 Chip Production Amid High Demand
Nvidia is urging SK Hynix to fast-track the production of its high-bandwidth memory (HBM4) chips as demand for AI hardware continues to soar. According to
SK Hynix Speeds Up Release of New AI Chips At Nvidia’s Urging
SK Hynix Inc. is accelerating the launch of its next-generation AI memory chips after Nvidia Corp. Chief Executive Officer Jensen Huang asked the South Korean supplier if it can provide samples six months earlier than originally planned,
Nvidia Asks S Korea SK Hynix To Pull Forward Chip Deliveries
The head of AI computing giant Nvidia asked South Korea's SK hynix to speed up delivery of newer, more advanced HBM4 chips by six months, the head of SK Group said Monday.
Nvidia's Huang asked SK Hynix to bring forward supply of HBM4 chips by 6 months, SK's chairman says
Nvidia CEO Jensen Huang asked memory chip maker SK Hynix to bring forward the supply of its next-generation high-bandwidth memory chips (HBM) called HBM4 by six months, SK Group chairman Chey Tae-won said on Monday.
SK Hynix rallies 6.5% after Nvidia boss Jensen Huang asks firm to expedite next-generation chip
SK Group Chair Chey Tae-won said Nvidia CEO Jensen Huang asked him if SK Hynix could move the supply of high-bandwith memory (HBM) chips forward by six months.
Jensen Huang asked SK hynix to give Nvidia 12-layer HBM4 chips earlier
HBM3E hardly off the manufacturing line Nvidia CEO Jensen Huang asked Korean chipmaker SK hynix to pull forward delivery of 12-layer HBM4 chips by half a year, according to the company's group chairman Chey Tae-won.
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